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On January 24, 2019, the first 8-inch (200mm) device was moved in;

On June 30, 2019, the first 8-inch (200mm) silicon wafer rolled off the assembly line;

On August 23, 2019, the first 12-inch (300mm) equipment was moved in;

On September 21, 2019, the construction of the semiconductor wafer project was completed;

On November 22, 2019, the semiconductor wafer project was officially completed and put into production;

On December 30, 2019, the first 12-inch (300mm) silicon wafer rolled off the assembly line;

The large-size semiconductor wafer project of Shanghai Shenhe Thermo-Magnetics Co.,Ltd. was completed and put into production. At the same time, Yinhe Ningxia Semiconductor Wafer Co.,Ltd., funded and constructed by Shenhe Thermo-Magnetics, was completed. Jointly constructed the first phase of the project with an annual output of 1.8 million 8" semiconductor-grade monocrystalline silicon wafers;

On September 28, Hangzhou Semiconductor Wafer Co.,Ltd. officially settled in Qiantang District, Hangzhou. The project has three 8-inch (200mm) and two 12-inch (300mm) semiconductor wafer production lines;

The "High-performance N-type semiconductor silicon wafer" project of Shanghai Shenhe Thermo-Magnetics Co.,Ltd.was included in the 2014 Shanghai Municipal Technology Absorption and Innovation Plan;

Wafer project officially put into production